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CERAMICS

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CERAMICS

Ceramic Packages and Substrates

RF Materials provides ceramic packages with superior mechanical properties, suitable for small, high density,
and surface mountable applications. Hermetic or vacuum-sealing is typically applied to ensure device quality.

Applications Features
Flexible production capability,
accepting small-quantity orders to
high volume production requirements 		Optical Communications PKG
(TOSA/ROSA, BTF, TO)
RF Power TR & High Frequency PKG
Flexible shape capability by strictly controlled
green sheet lamination technology 		Various Sensor Package
MEMS, SMD Package
Range of applications from single-layer
to multilayer ceramics (Mo/Mn , W etc.) 		Hybrid IC with mixed Power circuit
Ceramic Heater
RFMTL assists in design optimization
by providing electrical and thermal simulations 		-
-

HTCC Multilayer Ceramics Technologies

We are building a ceramic manufacturing platform with a laminate structure based on HTCC. Due to its multilayered
structure, circuit designs can be delivered flexibly through layers and complex structures, e.g. cavity structures, are available.

Green Sheet Tape Casting & Sheet Forming

  • Ceramic green sheets are manufactured by the doctor blade method
    under strict control
  • Manufactured thickness range is 0.02~0.5mm (6~12"/sq)

Processing Via and Cavities

  • Processing holes and cavities on ceramic sheets using a punching
    pin-die unit
  • Drilling & scribing work process on green sheet using CO₂
    and IR laser source

Screen Printing and Lamination

  • Printing process for multilayer boards and via-hole filling
  • Green sheet lamination process of Multi-layer boards

High Temperature Co-Firing

  • Ceramic firing conditions are produced by Co-debinding & Co-firing in a
    humidified hydrogen atmosphere

Ceramic Material Properties and Design Rules

Various bar stacks can meet the needs of diverse customers. We manufacture package and do
packaging in house

Material Properties

Item Unit HTCC
White Black
Material name - MHA-94 MBA-92
Dielectric Constant @ 1MHz
10GHz 		9.4
8.8 		9.8
9.2
Dielectric loss tangent (Tan δ) @ 1MHz
10GHz 		5x10⁻⁴
1x10⁻³ 		4x10⁻⁴
1x10⁻³
Thermal conductivity W/mK 26 17
TCE ppm/°C 7.5 7.4
Density g/cm² 3.6 3.6
Flexural strength MPa >350 >350
Conductor Materials - W, Mc W, Mo
Volume Resistivity Ω.cm >1012 >1012
Alumina contents % 94 92

Design Rules for HTCC (EXPOSED SURFACE LAYER)

Location Spec.
a Via Hole Diameter ≥150
b Via Hole Land ≥400
c Via Hole Pitch ≥650
d
Via Catch Pad to Line
- w/Via from Upper layer
- w/o Via from Upper layer
≥300
≥200
e Via Catch Pad to Substrate Edge ≥650
f Via Catch Pad to Cavity Edge ≥650
g Line Width ≥150
h Line Spacing ≥100
i Line to Substrate Edge ≥500
j Line to Cavity Edge ≥500
k Castellation to Line ≥250
l Castellation to Via Catch Pad ≥300