| PATENT NAME |
APPLICATION No. |
RESISTRATION No. |
| Cooling structure of laser diode |
10-2022-0163568 |
|
| CONTACTLESS RF CHARACTERISTIC MEASURING SYSTEM AND ITS METHOD |
10-2022-0086139 |
|
| Laser module package |
10-2022-0005935 |
|
| Laser module package |
10-2022-0004566 |
|
| Laser module package |
10-2022-0004547 |
|
| Heat sink having clad vertical mesh structure and manufacturing method thereof |
10-2021-0178431 |
10-2367549-0000 |
| Package structure with air gap |
10-2021-0150615 |
10-2415918-0000 |
| HEAT SINK MATERIAL WITH NIKEL DIFFUSION LAYERS AND METHOD OF MANUFACTURING THE SAME |
10-2021-0111131 |
10-2341058-0000 |
| MoCu HEAT DISSIPATION MATERIAL WITH CARBON PARTICLES AND PREPARING METHOD THEREOF |
10-2019-0140116 |
10-2231919-0000 |
| Cooling parts with excellent cooling performance |
10-2019-0070912 |
|
| Metal package for semiconductor devices that can prevent damage to the insulation |
10-2018-0092189 |
|
| Cooling parts |
10-2018-0160719 |
10-2166978-0000 |
| Spot plating method for AuSn solder alloy |
10-2018-0062873 |
|
| Manufacturing method of tungsten-copper clad alloy and clad alloy using the same |
10-2017-0010284 |
10-1890396-0000 |
| Cladding material and its manufacturing method, heat Sink |
10-2014-0061501 |
10-1535438-0000 |
| Cladding material and its manufacturing method, heat Sink |
10-2014-0059486 |
10-16152346-0000 |