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TECHNOLOGY

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TECHNOLOGY

Technology

TECHNOLOGY POSSESSION

Core technology for PKG

  • 01

    Heat sink Material technology

    Heat sink Material : CPC, CMC, S-CMC, CuW, MoCu

  • 02

    Ceramic material technology

    Package : Insulator ceramic process

  • 03

    Super-high frequency design technology

    Package performance:Simulation, Interpretation & Measurement

  • 04

    LD(Laser Diode) Module technology

    Module heat dissipation, optics, component alignment, high power module process technology

  • 05

    Surface treatment technology

    Package : Surface treatment process for corrosion and oxidation resistance

  • 06

    Dissimilar materials bonding technology

    High precision bonding with different thermal properties

CORE TECHNOLOGY SKILL

01 Heat sink material technology

  • High Heat conductivity
  • Coefficient of low thermal expansion
  • Diffusion Bonding
  • Infiltration

02 Ceramic Material Technology

  • Ceramic Green Sheet
  • Single and Multi Layer Ceramic

03 Super-high frequency design technology

  • RF Design – Interpretation - Measurement
  • Impedance Matching
  • Low Insertion Loss
  • Low Reflection Coefficient
  • Broadband

04 Laser Diode Module Technology

  • Module Proof Heat Design Technology
  • Optical Design Technology
  • Optical Component Precision Alignment Technology
  • High-power Module Process Technology

05 Surface Treatment Technology

  • Ni/Au
  • Ni/Pd/Au
  • Ni/Co/Au
  • AuSn

06 Dissimilar Materials Bonding Technology

  • Package Design and Precess
  • Brazing
  • Glass Sealing
  • Soldering