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PACKAGES

PRODUCT

PACKAGES

RF 및 Microwave 패키지

RF Materials provides ceramic to metal seal packages for RF and microwave modules.
Ceramic with low electrical resistance and heat sink with high thermal conductivity are available for high power.

Packages for RF Power transistors and MMICs in use of broadband amplifiers,
wireless infrastructure and various industrial applications

Packages for High Power, High Frequency Radar System and Satellite communications

HEAT SINK TYPE

HEAT SINK	THERMAL CONDUCTIVITY (W/mK)
W-Cu	180 ~ 230
Mo-Cu	170 ~ 270
CMC	180 ~ 250
CPC (141/111/212)	170 ~ 320
SUPER-CMC	290 ~ 350
Cu-DIA	600~800
Cu	390

CERAMIC

ALUMINA CONTENT	90~96%
DIELECTRIC CONSTANT (@1MHz)	9 MIN
CTE (10⁻⁶/°C)	7.2 MAX
THERMAL CONDUCTIVITY (W/mK)	15 MIN
CONDUCTOR(Pattern) MATERIAL	W, Mo-Mn

LEAD PIN

MATERIAL	KOVAR OR ALLOY42
THICKNESS (mm)	0.1~0.2

FINISH (PLATING)

Ni	Electroplated sulfamate Nickel; 2 - 7um
Au	Electroplated matt gold; 0.5 - 2.5 um
Application	Wire Bondable, Solderable, Die attachable

광통신 패키지

RF Materials offers custom and semi-standard packages for fiber optic communication such as WADM Modules, Optical Modulators, Attenuators,
Pump Laser, Switches, Amplifiers and Tunable Filters with any custom machined configuration in a variety of material and feedthrough/interface options.

Packages for RF Power transistors and MMICs in use of broadband amplifiers, wireless infrastructure and various industrial applications

Packages for RF Power transistors and MMICs in use of broadband amplifiers, wireless infrastructure and various industrial applications

Packages for RF Power transistors and MMICs in use of broadband amplifiers, wireless infrastructure and various industrial applications

레이져모듈 패키지

RF Materials provides custom packages for Fiber Laser Sources, DPSS Solution and other Optoelectronics in field of Medial, Industrial and Military
applications such as OCT system, Thermal Imaging and Material Processing.